TR2018-194

Trip Report on International Symposium on the Physical and Failure Analysis of Integrated Circuits 2018 and NTU-MIT Alliance Labs Visit


    •  Teo, K.H., "Trip Report on International Symposium on the Physical and Failure Analysis of Integrated Circuits 2018 and NTU-MIT Alliance Labs Visit," Tech. Rep. TR2018-194, Mitsubishi Electric Research Laboratories, March 2019.
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      • @techreport{Teo2019mar2,
      • author = {Teo, Koon Hoo},
      • title = {Trip Report on International Symposium on the Physical and Failure Analysis of Integrated Circuits 2018 and NTU-MIT Alliance Labs Visit},
      • institution = {Mitsubishi Electric Research Laboratories},
      • year = 2019,
      • month = mar,
      • url = {https://www.merl.com/publications/TR2018-194}
      • }
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  • Research Areas:

    Applied Physics, Electronic and Photonic Devices


Koon Hoo Teo attended the International Symposium on the Physical and Failure Analysis of Integrated Circuits 2018, Singapore, from July 16 -19, 2018. The conference was well attended and there were about 250 attendees with a good mix from both academia and industry. One of the keynote speakers, Prof. Muhammad Ashraf Alam of Purdue University highlighted the followings: The von-Neumann computing architecture itself is expanding to include neural networks, guided by the specialized needs of ecosystem companies, such as Amazon, LinkedIn, and eBay. This sea-change in computing technology must be supported by a corresponding broadening of our focus on multi-component reliability physics. Deep understanding on the reliability physics of logic and power transistors, sensors, solar cells, and batteries is important and create a platform that predicts the integrated, system-level reliability.